Sony Bails on Chip Development Partnership

Posted 04-09-07
Written by: David Chapman

Back in February of last year, Sony stated that it was joining up with Toshiba and NEC Electronics to co-develop technologies to make new processing chips with an ultra fine circuitry width of 45 nanometers, sharing hefty costs and pooling technological expertise. For those without a degree in electrical engineering, the smaller circuitry width decreases the size of a chip and enables data to be processed faster. As an added bonus, smaller circuit width also cuts production costs per chip.

 

Sony, Toshiba, and NEC announced in December they had developed a method for volume production of the advanced chips. In March, though, the partnership contract between the three expired. On Saturday, Toshiba and NEC Electronics announced their plans to sign a new contract, working together to develop energy-saving and other technologies to improve the next-generation chips, Kyodo news agency said on Saturday. But where is Sony in this new equation?

 

Sony said on Saturday it has no plans to pursue further development of advanced microchips. Since the next stage of development would have more to do with production than the initial phase and Sony is considering contracting out production of 45-nanometer chips, it will not renew its contract with Toshiba and NEC Electronics, a Sony spokesman said.




              

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